Description

1. Suitable for disassembly and soldering of a variety of components, such as: SOIC, CHIP, QFP,PLCC, BGA, etc.
2. Suitable for heat shrinkage, drying, paint removal, debonding, thawing, preheating, disinfection,Glue welding, etc.
3. The air volume is adjustable, suitable for fields that require small air volume and large air volume heating Together.
4. Suitable for lead-free hot air desoldering occasions. Power: 1000W Voltage: AC 220V /110V Temperature range: 100 degC ~ 500 degC Air volume ratio range: 1 to 120 Maximum air flow: 120L / min Dimensions: 188 (L) times 245 (D) times 135 (H) mm

Specification